Opportunities in the OSAT market have evolved through a number of stages i.e. from array packaging technology to 2.5D/3.0D advanced IC packages. Lucintel has found the future of this market to be promising; the OSAT market is expected to reach $32.5 billion by 2025 with a CAGR of 3.7%. In this market, wire bond is expected to remain the largest packaging type and computer and networking segment is expected to remain the largest end use type. Players can benefit from the available opportunities like increasing electronic content per vehicles, and growing industrial automation.
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ASE, Amkor, JCET, SPIL, and PTI are some of the companies profiled in this report.
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