Zion Market Research has published a new report titled “Electronic Thermal Management Materials Market Report by Product (Conductive Pastes, Conductive Tapes, Phase Change Materials, Gap Fillers, and Thermal Greases) and by End-Use Industry (Consumer Electronics, Automotive, Aerospace, Healthcare, and Telecommunication): Global Industry Perspective, Comprehensive Analysis, and Forecast, 2018 – 2026” According to the report, the Electronic Thermal Management Market accounted for USD 1.59 Billion in 2018 and is expected to reach USD 2.94 Billion by 2026, growing at a CAGR of around 8 % between 2019 and 2026.
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The global electronic thermal management materials market is expected to observe noticeable growth over the years. In the electrical assemblies, the electronic thermal management materials are broadly utilized for heat dissipation purposes in order to provide proper conduction of heat. These materials play a crucial role in the electronic assembly as it amplifies performance and improves the reliability of the electronic devices. Moreover, the rising penetration of complex electronic designs is likely to be the key factor bolstering the demand for electronic thermal management materials over the years. Also, the growing demand for consumer electronic products mainly from emerging economies in the U.S., China, Japan, and India is anticipated to grow the sales of the global electronic thermal management materials market within the forecast period.
The global electronic thermal management materials market has been categorized on the basis of product and end-use industry. Based on the product, electronic thermal management materials are classified into conductive pastes, conductive tapes, phase change materials, gap fillers, and thermal greases. The conductive paste segment is likely to have a prominent share owing to the excellent thermal conductivity, electrical conductivity, superior adhesive strength and functional protection to the electronic components. The use of conductive paste also reduces the requirement for clips and screws in the electronic circuits thereby reduce the weight of the electronic device. The rising demand for low weight and efficient thermal management materials is expected to boost up the growth of this segment within the forecast period. The conductive tape segment is further divided into epoxy, silicone, and acrylic.
The epoxy-based thermal pastes are expected to grow at a noticeable rate due to the low cost of pastes and excellent properties such as low curing time. Gap fillers and thermal grease are other leading product segments in the global thermal management materials market. Based on the end-use industry, electronic thermal management materials are classified into consumer electronics, automotive, aerospace, healthcare, and telecommunication industries. The consumer electronics segment is anticipated to be the leading segment in the global electronic thermal management materials market within the forecast period, owing to the rising penetration of consumer electronics in the developing nations across the globe. The healthcare industry segment is also estimated to grow at a noteworthy rate owing to the rising research & development activities in the modernization of healthcare electronics. Telecom and automotive electronics are other major end-user industries contributing to the growth of the global electronic thermal management materials market within the forecast period.
The key players in the global electronic thermal management materials market are Boyd, Laird PLC, Henkel AG & Company, Honeywell International Inc., Lord Corporation, European Thermodynamics Ltd, Marian Inc, Darcoid company, Parker Chomerics, Amerasia International (AI) Technology Inc, 3M, DuPont, Wacker AG, and Dr Dietrich Muller Gmbh among others.
This report segments the global electronic thermal management market as follows:
Global Electronic Thermal Management Materials Market: Product Segment Analysis
Global Electronic Thermal Management Materials Market: End-Use Segment Analysis
Global Electronic Thermal Management Materials Market: Regional Segment Analysis
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