The hermetic packaging market size is projected to reach USD 4,516 million by 2023 from an estimation of USD 3,250 million in 2017, at a CAGR of 6.8%.
The key factors driving this market is growing need of protecting highly sensitive electronic components from extraneous particles, such as moisture, atmospheric pressure, and soil/grime; and strong demand for hermetically packaged components from the industries such as automotive, electronics, and aeronautics. Furthermore, underlying opportunities in this space include increasing adoption of hermetic packaging for protection of electronic implantable medical devices and rising demand from APAC countries for hermetically packaged components and ICs for myriad applications.
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Hermetically packaged transistors are mostly offered as single, dual, or quad channel. They are capable of operating at a military temperature range of −55°C to +125°C. Each channel of these transistors contains a gallium arsenide phosphide (GaAsP) light-emitting diode optically coupled to an integrated photon detector. Separate connections for photodiodes and output transistor collectors reduce the base-collector capacitance and lead to increase in the speed of operation of up to a hundred times over that of a conventional transistor or optocoupler. These hermetically packaged transistors can be used for applications such as the designing of telecommunication circuits and home appliances. Semelab plc. (UK), Texas Instruments Incorporated (US), and Agilent Technologies (US) are some of the companies that offer hermetically sealed transistors.
The hermetic packaging market for Ceramic-Metal Sealing (CERTM) held the largest market share of the hermetic packaging market in 2017 owing to growing demand for thermal shock-resistant and low-porosity type of hermetic packaging material. Ceramic–metal seals are used in industries that entail high operating temperature, high voltage withstanding, biocompatibility, or special chemical resistance. For instance, owing to the need for high vacuum integrity and miniaturization of input or output terminals, infrared applications need high temperature cofired ceramic (HTCC) feedthroughs to provide design solutions for next-generation fiber-optic telecommunication packages, night vision seekers, and fire-control systems. Key manufacturers of bulk these modules are Schott (Germany), Ametek (US), and Amkor Technology (US).
Asia Pacific accounted for the largest share of the hermetic packaging market in 2017. The market in APAC has been segmented into China, Japan, South Korea, India, and Taiwan. Growing energy needs, emerging economies, and increasing defense spending are some of the factors driving the growth of this market in the region. In the last few years, the demand for hermetic packaging has significantly increased for the military & defense, aeronautics and space, automotive, and energy and nuclear safety industries. The rising military capabilities of developing countries, such as China, India and South Korea, in APAC are boosting the demand for hermetic packaging for sensitive electronic components.
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Schott (Germany), Teledyne Microelectronics (US), Ametek (US), Texas Instruments (US), and Amkor Technology (US). Other major players in the hermetic packaging market include Kyocera (Japan), Materion (Japan), Egide (France), Micross Components (US), Legacy Technologies (US), Willow Technologies (UK), Intersil (Japan), SGA Technologies (UK), Complete Hermetics (US), SHP (US), Primoceler (Finland), Coat-X (Switzerland), Hermetics Solutions Group (US), Stratedge (US), and CHI (China) are a few major players in the hermetic packaging market.
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