Opportunities in the capillary underfill material market have evolved through a number of stages. Lucintel has found the future of this market to be promising; the capillary underfill material market is expected to grow with a CAGR of 8% to 10%. In this market, flip-chip is expected to remain the largest application. Players can benefit from the available opportunities like growth of the semiconductor industry.
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Zymet, Epoxy Technology Inc., H.B. Fuller, Henkel Ag & Co. Kg, Namics Corporation, Nordson Corporation, Yincae Advanced Material, LLC, Master Bond are some of the companies profiled in this report.
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