Opportunities in the high-density interconnect printed circuit board (HDI PCB) market have evolved through a number of stages i.e. from conventional HDI PCB to any layer HDI. Lucintel has found the future of this market to be promising; the high-density interconnect printed circuit board (HDI PCB) market is expected to reach $16.4 billion by 2025 with a CAGR of 7%. In this market, smartphone is the largest segment by end use industry whereas 4-6 layers HDI is the largest by technology. Players can benefit from the available opportunities like increasing electronic content in automotive and growth in consumer electronic devices & telecommunication products.
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Compeq Manufacturing Co. ltd, AT&S Austria Technologies & System Technik AG, Unimicorn Technology Corp, TTM Technology, Ibiden Co. ltd are some of the companies profiled in this report.
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This exclusive report from Lucintel will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link helpdesk@lucintel.com
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Lucintel, the premier global management consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, growth consulting, M&A, and due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com.
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