According to IMARC Group’s latest report, titled “RF Front End Module Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2020-2025”, the global RF front end module market grew at a CAGR of around 12% during 2014-2019. Looking forward, IMARC Group expects the global market to continue its moderate growth during the next five years.
A radio frequency (RF) front end module is a device panel that combines all circuits between the antenna and the receiver. It comprises of an RF filter, amplifier, local oscillator, mixer and multiple switches. RF front end module is generally used to minimize the image response and control strong out-of-band signals from saturating the input stages. The module is also adopted for switching between the radio signal and baseband frequency in wireless systems and frequency modulation (FM) radios to encode/decode the signals during transmission. As a result, it is widely used to manufacture consumer electronics, automobiles, military equipment, and wireless communication tools.
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Rapid digitalization and growing industrial automation are primarily driving the adoption of RF front end modules. Furthermore, the extensive use of social media platforms and IoT devices has induced the traffic generated from data-intensive industries, such as banking, financial services and insurance (BFSI). This has enhanced the consumer preferences towards smart devices equipped with RF modules, thereby further catalyzing the market. Additionally, several technological advancements have led to the development of silicon-on-insulator (SOI) substrates that support the functioning of 3G, 4G/LTE, and future network requirements to facilitate faster and reliable data transmission.
IMARC Group provides an analysis of the key trends in each sub-segment of the global rf front end module market report, along with forecasts for growth at the global, regional and country level from 2020-2025. Our report has categorized the market based on region, component and application.
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Breakup by Component:
Breakup by Application:
Breakup by Region:
The report has also analysed the competitive landscape of the market with some of the key players being Broadcom Inc., Infineon Technologies AG, Murata Manufacturing Co. Ltd., NXP Semiconductors N.V., Qorvo Inc., Skyworks Solutions Inc., STMicroelectronics N.V., Taiyo Yuden Co. Ltd., TDK Corporation, Teradyne Inc. and Texas Instruments Incorporated.
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