A new study on the global packaging market for compound semiconductor has been recently added to the vast repository of Report Ocean. The report, titled “Packaging Market For Compound Semiconductor By Packaging Platform (Flip Chip, Embedded Die, Fan-In WLP, and Fan-Out WLP), Application (CS Power Electronics, CS RF/Microwave, CS Photonics, CS Sensing, and CS Quantum), and End User (Digital Economy, Industrial and Energy & Power, Defense/Security, Transport, Consumer Electronics, Healthcare, and Space): Global Opportunity Analysis and Industry Forecast, 2020–2027” offers a detailed study of this market on the basis of its past and current performance.
As per the report, the worldwide packaging market for compound semiconductor reached US$11.63 bn in 2019. Expanding at a CAGR of 10.40% during the period from 2020 to 2027, the market is anticipated to touch US$25.61 bn by the end of the forecast period. The rising preference for miniaturized devices is the key factor behind the growth of this market. Constant improvements in the performance of systems and the optimization of compound semiconductor packaging and various emerging trends in compound semiconductor wafers in the automotive industry are also driving this market substantially.
On the other hand, the global compound semiconductor packaging market may be hampered by the high cost of raw materials used in packaging in the near future. Nonetheless, the rising usage of compound semiconductors in smart technologies and the emergent trends of fan-out wafer level packaging are projected to offer growth opportunities to market players over the next few years.
Impact of Covid 19 on Global Packaging Market for Compound Semiconductor
The impact of Covid 19 on the global packaging market for compound semiconductor is predominantly negative. The focus has been shifted to the healthcare industry, especially on the Covid 19 treatment, at present. With reduced investments and lesser product launches, this market has been disturbed a bit over these few months. However, as the economies are opening up, it is likely to return to its normal pace soon.
Global Packaging Market for Compound Semiconductor: Dynamics
In this research study, the global packaging market for compound semiconductors has been analyzed on the basis of the packaging platform, application, end user, and the region. Based on the packaging platform, the market has been classified into flip-chip, embedded die, fan-in WLP, and fan-out WLP. The flip-chip segment dominates the worldwide market. On the basis of the application, the packaging market for compound semiconductor has been evaluated across CS power electronics, CS RF/Microwave, CS Photonics, CS Sensing, and CS Quantum. Among these, the CS power electronics led the global market in 2019 and is anticipated to expand at a CAGR of 8.90% over the forecast period.
In terms of the end user, the market has been studies across digital economy, industrial and energy and power, defense/security, transport, consumer electronics, healthcare, and space. The consumer electronics segment has been leading the market and is expected to remain doing so over the next few years. Geographically, it has been assessed across the U.S., the U.K., China, and the Rest of the World. China has acquired the dominant position in the overall market.
The global packaging market for compound semiconductor is segmented into:
By Packaging Platform
By End User
Companies Mentioned in the Report