Fan-out Wafer Level Packaging Market 2020
Fan-out Wafer Level Packaging is an advanced level of packaging that follows integrated circuit packaging technology. The packaging system focuses on to provide a greater number of external contacts with a silicon die. The Fan-out Wafer Level Packaging is a more active way of manufacturing and eliminates the size constraints of a normal die. It enhances a larger number of connections between the application board and the package.
Fan-out Wafer Level Packaging is one of the latest trends in the packaging industry. To gain higher productivity and, to lower the costs, larger form factors are introduced. Fan-out Wafer Level Packaging has the potential for miniaturization and also for heterogeneous packaging. This technology can find better applications in targeted energy harvester, where heterogeneous components have to be integrated into a miniaturized system.
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Fan-out Wafer Level Packaging is far better than the conventional wafer-level packaging for a greater number of external I/Os and system-in-package (SIP) solutions. Fan-out Wafer Level Packaging process involves dicing chips on a silicon wafer or a glass wafer. The good dies are then re-positioned on a carrier wafer or panel. The carrier is then re-constituted by molding, followed by making redistribution layer atop the molded area and then forming solder balls on top.
Fan-out Wafer Level Packaging has higher board-level reliability. The Fan-out area removes the pad limitation issue and can be customized. Fan-out Wafer Level Packaging uses only the good dice. It has lower thermal resistance with built-in back-side protection.
By fanning out the contacts beyond the dimensions of the chip, the technology provides a larger I/O count. The industry is working in a cost-effective format. The panel format lowers the cost by enabling more die. There lies the future potential for SIP and 3D integration. It has simplified the supply chain infrastructure.
The development in Fan-out Wafer Level Packaging will enable to development of cost-efficient advanced packaging solutions, and spur high volume manufacturing of IoT technologies thus, will drive the market ahead. The growing demand for compact electronics will drive the market of Fan-out Wafer Level Packaging further.
In terms of region, North America, South America, and Europe to show extensive growth in the Fan-out Wafer Level Packaging market with higher expenditure capabilities and strong infrastructure. The manufacturing industry is turning more innovative with the latest developments which will increase the demand for Fan-out Wafer Level Packaging.
The global Fan-out Wafer Level Packaging market shows excellent growth in the Middle East, Africa, and Asia-Pacific (APAC) with a higher demand for Fan-out Wafer Level Packaging. Fan-out Wafer Level Packaging technology will rise in demand due to its suitability for applications that require high power and extreme miniaturization. The regional market is quite ready for the coming years as several investments have made the revamping process much more enduring. Regions are also revamping its existing industrial infrastructure by including advanced technology.
The main players in the global Fan-out Wafer Level Packaging include STATS ChipPAC, TSMC, Texas Instruments, and other prominent vendors are Rudolph Technologies, SEMES, SUSS Micro-Tec, STMicroelectronics and Ultratech.
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