HTF Market Intelligence released a new research report of 150 pages on title ‘Global Wireless Module Market Insights by Application, Product Type, Competitive Landscape & Regional Forecast 2025’ with detailed analysis, forecast and strategies. The market Study is segmented by key regions that is accelerating the marketization. The study is a perfect mix of qualitative and quantitative Market data collected and validated majorly through primary data and secondary sources.
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According to AMA, the Wireless Module market will register a CAGR of above 11.5% by 2025. The study covers a detailed analysis segmented by key business segments i.e. by type (Bluetooth, Wi-Fi, RF Module and Antenna, ZIGBEE/XBEE Modules and Others (Long-Term Evolution (LTE), WiMax, High-Speed Packet Access (HSPA))) , by application (Smart Appliances, Handheld Mobile Devices, Medical and Industrial Testing, IoT Devices and Sensors and Others (Digital Signage, Remote Monitoring/SCADA)) and major geographies. Research Analyst at AMA predicts that United States Players will contribute to the maximum growth of Global Wireless Module market throughout the predicted period.
The competition is expected to become even more intense in the coming years with the entry of several new players in the market. To help clients improve their revenue shares in the market, this research study provides an in-depth analysis of the market’s competitive landscape and offers information on the products offered by various leading companies. Additionally, this Wireless Module market analysis report suggests strategies Players can follow and recommends key areas they should focus on, in order to take maximum benefits of growth opportunities.
The report offers several leading Players, including:
Laird Connectivity (United States)
Murata Manufacturing Co., Ltd. (Japan)
Advantech Co., Ltd. (United States)
Taiyo Yuden (United States)
Azure Wave Technologies (Taiwan)
Silicon Laboratories (United States)
Texas Instruments Incorporated (United States)
Sierra Wireless (Canada)
Grid Connect Inc. (United States)
Microchip Technology (United States)
On January 16, 2020, Lantronix, Inc., a global provider of secure data access and management solutions for the industrial Internet of Things (IoT), has announced that it has completed the acquisition of all of the outstanding shares of Intrinsyc Technologies Corporation, a leading provider of solutions for the development of embedded and IoT products.
Low-power Wireless Modules owing to Application in Smart and Energy Saving Devices
Wi-Fi implementation is very expensive when compared to the wired connection
Stringent Government Regulations owing to Harmful Radiations
Growing Technological Advancements such as IoT and Smart Appliances and Huge Investments in Research and Developments
Key highlights of the Global Wireless Module market Study:
• CAGR of the market during the forecast period 2019-2025
• Detailed information on factors that will accelerate the growth of the Wireless Module market for the next five years.
• Forecast of the Global Wireless Module market size and its contribution to the parent market by type, application and by country.
• Insights on upcoming trends and changes in consumer behaviour
• Uncovering market’s competitive landscape and in-depth information on various Players
• Comprehensive information about factors that will challenge the growth of Wireless Module Players
Customization in the Report Available:
The Study can be customized to meet your requirements. Please connect with our representative, who will ensure you get a report that suits your needs.
Data related to EXIM [Export- Import], production & consumption by country or regional level break-up can be provided based on client request**
** Confirmation on availability of data would be informed prior purchase
The top-down and bottom-up approaches are used to estimate and validate the size of the Global Wireless Module market.
In order to reach an exhaustive list of functional and relevant players various industry classification standards are closely followed such as NAICS, ICB, SIC to penetrate deep in important geographies by players and a thorough validation test is conducted to reach most relevant players for survey in Wireless Module market.
In order to make priority list sorting is done based on revenue generated based on latest reporting with the help of paid databases such as Factiva, Bloomberg etc.
Finally the questionnaire is set and specifically designed to address all the necessities for primary data collection after getting prior appointment> by targeting key target audience that includes Wireless Module Manufacturers, Embedded System Engineers, Component & Part Suppliers, Electronic Appliance Manufacturers, Distributors/Traders/Exporters/Importers, New Entrants/Investors, End-Use Industries and Others.
This helps us to gather the data for the players’ revenue, operating cycle and expense, profit along with product or service growth etc.
Almost 70-80% of data is collected through primary medium and further validation is done through various secondary sources that includes Regulators, World Bank, Association, Company Website, SEC filings, OTC BB, Annual reports, press releases etc.
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