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iCrowdNewswire Jul 30, 2020 8:37 PM ET

Multi-chip Modules Market Driven by Growing Demand from Consumer Electronics, Automotive Industries – Global Forecast till 2023 (SARS-CoV-2, Covid-19 Analysis)

iCrowd Newswire - Jul 30, 2020

Multi-chip Module Market

The sudden challenges created by the ongoing COVID-19 are captured effectively to exhibit the long term growth projections in the MRFR report on Multi-chip Module Market. The growth sectors of the Multi-chip Module Market are identified with precision for a better growth perspective.

The global multi-chip module market is expected to exhibit a strong 6.1% CAGR over the forecast period from 2018 to 2023, according to a new report published by Market Research Future (MRFR).


Multi-chip modules are an IC technology that allows for a single IC module to hold multiple processing units, increasing the overall output of the unit. The presence of multiple units on multi-chip modules makes the modules smaller and lighter than conventional modules, as well as reducing the costs compared to the number of separate modules that would have had to be produced by the conventional method to match the processing power of the multi-chip module. These features are highly suitable for the semiconductors industry, which is presently focused on miniaturization of electronic components as a key trend of the future. The growing demand for miniaturized electronic components is likely to be a major driver for the global multi-chip module market over the forecast period from 2018 to 2023.

Multi-chip packaging modules are a significant aspect of modern miniaturization electronics and microelectronic systems. There will continue to grow demand for more miniaturization of consumer goods, aerospace and defense systems, medical devices and LED arrays. The Multi-Chip Module (or MCM) was designed to encourage its use as a single package for multiple integrated circuits (or ICs). Multi-chip modules differ depending on their designers ‘complexity and engineering strategies, and consumer or end-user needs. For example, on a small printed circuit board, one customer can require pre-packaged ICs to duplicate the product footprint of an existing chip product. Another customer can need a completely customized package, which includes several chips on a substratum.

Multichip modules (MCM) are, in fact, hybrid microcircuits in which the packaging technology was further motivated by the need to get the maximum electrical output from VLSI and other high-speed devices. While there is no clear concept of MCMs and although almost every electronic module is called an MCM because of its glamour, MCMs are in fact the latest generation of hybrid microcircuits in which the materials and processes have been optimized and expanded to achieve at least an improvement in electrical efficiency in order of magnitude (such as speed) and the order of magnitude the density increases.

To accomplish this, low dielectric-constant materials, including polymers and some ceramics, are used as dielectric interlayers for interconnecting multilayer substrates to monitor impedances, minimize signal attenuation and increase speeds. In addition, very fine conductor lines, narrow vias and short electrical paths are used to boost electrical efficiency and increase the packaging capacity, resulting in lighter, smaller, and higher electronic speeds.

Multichip modules (MCM) have been described in many ways, and are being used for all electronic circuits as a new discovery and packaging approach. However, for all the definitions, glamor, and hyperbole given to MCMs, they are necessary extensions of hybrid microcircuits; the differences are in complexity, density, and performance. Thus the basic hybrid microcircuit technologies mentioned in the previous twelve chapters also refer to MCMs to a large degree and must be understood in order to be used as a basis for further developments in high-density, high-performance electronic packaging.

Multichip modules (MCMs) and especially 3D stacked MCMs offer exceptional possibilities for high-performance, high-capacity signal processing, Particularly since the high degree of parallelism, locality of communication, and regularity of the structure of the signal processing can all be exploited in the MCM. Owing to the availability of significant parallelism in signal processing computing, power, dissipation is a primary concern. By reducing wire length, MCMs reduce communication energy and increasing the available interchip communication bandwidth through bonded I / Os region. Silicone-based solutions have intrinsic bypass capacitance of 25 nF / cm and very low inductance (0.1nH) connections to the solder bump pad. Power and ground connections can be distributed inside the chip to the point of usage, as well as system-wide clock delivery.

Competitive Analysis:

Leading players in the global multi-chip modules market include Texas Instruments Inc., Tektronix Inc., Macronix International Co. Ltd., Cypress Semiconductor, Micross, STMicroelectronics, Samsung Electronics, Infineon Technologies, Palomar Technologies, and SK Hynix Inc.

Product development is likely to be the key strategy of leading players in the global multi-chip module market over the forecast period, as the demand for multi-chip modules is growing in various sectors, presenting opportunities for a wide range of products. Major players in the global multi-chip module market are also likely to focus on acquisitions and collaborations as a way of acquiring emerging technologies.

Don’t miss out on business opportunities in Multi-chip Module Market. Get detailed report and gain crucial industry insights that will help your business grow.”

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