Global Info Research offers a latest published report on Flip Chip Bonder Market Analysis and Forecast 2019-2024 delivering key insights and providing a competitive advantage to clients through a detailed report. The report contains 158 pages which highly exhibit on current market analysis scenario, upcoming as well as future opportunities, revenue growth, pricing and profitability.
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Flip chip bumping is a vital step to the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a “spacer” to prevent electrical shorts and provides mechanical support.
Flip chips avoid wire bonding and therefore are able to be much smaller than their counterparts. Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and cost benefits enabled by the flip chip assembly method.
Flip Chip Bonder industry is relatively concentrated, manufacturers are mostly in the Europe, US and Asia. As for the downstream market, China sales accounted for more than 23.73% of the total sales of global Flip Chip Bonder in 2018. Besi is the world leading manufacturer in global Flip Chip Bonder market with the market share of 33.68%, in terms of revenue.
Compared to 2017, Flip Chip Bonder market increased sales by 5.92 percent to 608 units worldwide in 2018 from 574 units in 2017. It shows that the Flip Chip Bonder market performance is positive, despite the weak economic environment.
The Flip Chip Bonder market has witnessed significant growth in the past few years, and is expected to maintain this trend during the forecast period. The global Flip Chip Bonder market is expected to reach $563.57 million by 2025 from $276.18 million in 2019, growing at a CAGR of 12.62% from 2019 to 2025. And China market is expected to keep being the biggest market with sales market share of 33.55% in 2025.
The world leading enterprise in the Flip Chip Bonder market are Besi (NL), which followed by ASMPT (HK), Shibaura (JP), Muehlbauer (DE), K&S (US), Hanmi (KR), AMICRA (DE) and SET (FR). These Top companies currently account for more than 90% of the total market share and are expected to retain their dominating hold over the market during the forecast period.
Despite the presence of competition problems, investors are still optimistic about this area, in future still more new investment will enter into the field. Technology and cost are two major problems.
Although sales of Flip Chip Bonder brought a lot of opportunities, for the new entrants with only advantage in capital without sufficient support in technology and downstream channels, the research group did not recommend taking risk enter this market.
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